• Analog Circuit – an electrical circuit that provides a continuous quantitative output as a response from its input.
• Automated Test Equipment (ATE) – equipment that automatically tests and analyzes functional parameters to evaluate performance of the tested electronic devices.
• Built-In Self Test – an electrical testing method that allows the tested devices to test itself with specific added-on hardware.
• CAD – Computer Aided Design.
• CAM – Computer Aided Manufacturing.
• Chip – the individual circuit or component of a silicon wafer, The leadless form of an electronic component -as applies to a surface-mount component. Also applies to an IC - both surface-mount and through-hole varieties.
• Design For Manufacturing (DFM) – checks that ensure that the design fits the fabrication process requirements. DFM includes a check for minimal trace width, minimal trace-to-trace distance, minimal hole clearance, etc.
• Dielectric – an insulating medium between conductors.
• DIP – dual in-line package with two rows of leads from the base in standard spacing between the leads and row. DIP is a through-hole mounting package.
• DRC – Design Rule Check.
• Edge Connector – a connector on the circuit-substrate edge in the form of plated pads or lines of coated holes used to connect to other circuit boards or electronic devices.
• Electronic Component – a part of the printed circuit board, such as resistor, capacitor, transistor, etc.
• Fine Pitch – fine pitch is more commonly referred to surface-mount components with a lead pitch of 25 mils (0.025inches) or less.
• Footprint – geometry of pads for soldering an electronic component.
• Functional Test – the electrical testing of an assembled electronic device with simulated function generated by the test hardware and software.
• Gerber File – data file used to control a photo-plotter.
• Ground Plane – a conductive plane as a common ground reference in a multilayer board for current returns of the circuit elements and shielding.
• IC – Integrated Circuit.
• In-Circuit Test – electrical test of an individual component or part of the circuit without removing the component(s).
• Leakage Current – A small amount of current that flows across a dielectric area between two adjacent conductors.
• Legend – Printed letters or symbols on the board, such as part numbers and product numbers or logos.
• Minimum Conductor Width – The smallest width of any conductors, such as traces, on a board.
• Minimum Conductor Space – The smallest distance between any two adjacent conductors, such as traces, on a board.
• Net – a set of pads that are to be connected electrically on the board.
• Netlist – List of parts and their connection points which are connected in each net of a circuit.
• NPTH – Non-plated through-hole.
• Pad – Metallized area of the board for connection and attachment of electronic components.
• PCB – Printed Circuit Board.
• Pin– part of an electronic component that is soldered to the board.
• Pitch – the center-to-center spacing between conductors, such as pads and pins, on a board.
• Plastic Leaded Chip Carrier (PLCC) – a component package with J-leads.
• PTH (plated-through hole) – a plated hole used as a conducting interconnection between different layers or sides of a board either used as connection for through-hole component or as a via.
• Routing (tracing) – the process of placing electronic connections (traces) between pads on the board.
• Signal layer – layer of a board, in which traces can be placed. For a two-sided board two signal layers are available – the Top and the Bottom layers.
• Silk screen – a layer designed for placing legend elements on the top or bottom side of the board. Two corresponding layers are available – the Top Silk and the Bottom Silk.
• Small Outline Integrated Circuit (SOIC) – an integrated circuit with two parallel rows of pins in surface mount package.
• SMD – Surface Mount Device.
• SMT – Surface Mount Technology.
• Test Point – a specific point in a circuit board used for testing for functional adjustment or quality test in the circuit-based device.
• Thermal pad – pad of a special form used when it is connected to copper pours. Thermal pads improve solderability of the joint, reducing the chance of a so called “cold solder joint”.
• Through-hole – a drilled hole in the board, usually for mounting a component.
• Trace (or Route) – a layout or wiring of an electrical connection.
• UL – Underwriter’s Laboratories. A popular safety standard for electrical devices supported by many underwriters.
• Via – a plated-through hole used for interconnection of conductors on different sides or layers of a circuit board.
• Wave Soldering – a manufacturing operation in which solder joints are soldered simultaneously using a wave of molten solder.

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